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product structure silicon monolithic integrated circuit this product is not designed for pr otection against radioactive rays . 1/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 tsz22111 ?14 ? 001 www.rohm.com datashee t system lens drivers -step system lens driver for digital still cameras bu24031gw general description bu24031gw is a system le ns driver that uses -step driving to make the configur ation of the sophisticated, high precision and low noise lens driver system possible. this ic has a built-in driver for both dc motor and voice coil motor and a -step controller that decreases cpu power. therefore, multifunc tional lens can be applied. features ? built-in 5 channels driver block. 1ch-4ch: voltage control type h-bridge (adaptable to stm 1systems) 5ch: current control type h-bridge ? built-in 2 channels pi driving circuit ? built-in 3 channels waveforming circuit ? built-in fll digital servo circuit ? built-in pll circuit applications ? digital still cameras key specifications ? i/o power supply voltage: 1.62v to 3.6v ? digital power supply voltage: 2.7v to 3.6v ? driver power supply voltage: 2.7v to 5.5v ? output current (1ch-5ch): 500ma(max) ? input clock frequency: 1mhz to 28mhz ? fet on resistance (1ch-4ch): 2.0 ? (typ) ? fet on resistance (5ch): 1.0 ? (typ) ? operating temperature range: -20 to +85 package ucsp75m2 2.50mm x 2.50mm x 0.85mm typical application circuit example1 i 1ch driver 2ch driver 3ch driver 4ch driver photo interrupter logic mvcc12 mgnd m out1a out1b out2a out2b out3a out3b si2 si3 so3/sout so2 si1 so1 piout1 piout2 dvdd dvss fclk csb sclk sdata state in5 out4a out4b out5a out5b rnf5 dvddio mvcc3 mvcc4 vddamp 5ch driver main host
datasheet datasheet 2/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw pin configuration pin description land matrix no. pin name power supply function land matrix no. pin name power supply function b1 dvddio - i/o power supply a1 mvcc12 - 1ch, 2ch driver power supply b2 dvdd - digital power supply d3 mgnd - driver ground d2 dvss - ground a3 out1a mvcc12 1ch driver a output b3 fclk dvddio fclk logic input a2 out1b mvcc12 1ch driver b output e2 csb dvddio csb logic input a4 out2a mvcc12 2ch driver a output c2 sclk dvddio sclk logic input a5 out2b mvcc12 2ch driver b output e1 sdata dvddio sdata logic input d1 mvcc3 - 3ch driver power supply e3 state dvddio state logic input/ output f2 out3a mvcc3 3ch driver a output e4 in5 dvddio in5 logic input f3 out3b mvcc3 3ch driver b output f1 piout1 dvdd pi driving output 1 f4 mvcc4 - 4ch driver power supply b6 piout2 vddamp pi driving output 2 f5 out4a mvcc4 4ch driver a output c5 si1 dvdd waveforming input1 c1 ou t4b mvcc4 4ch driver b output b5 so1 dvddio waveforming output1 f6 vddamp - 5ch power supply of current driver control d5 si2 dvdd waveforming input2 d6 rnf5 - 5ch driver power supply e5 so2 dvddio waveforming output2 e6 out5a rnf5 5ch driver a output a6 si3 dvdd waveforming input3 c6 out5b rnf5 5ch driver b output b4 so3/sout dvddio waveforming output3/ sout logic output (bottom view) f e d c b a 1 2 3 4 5 6 piout1 out3a out3b mvcc4 out4a vddamp sdata csb state in5 so2 out5a mvcc3 dvss mgnd si2 rnf5 out4b sclk si1 out5b dvddio dvdd fclk so3/ sout so1 piout2 mvcc12 out1a out1b out2a out2b si3
datasheet datasheet 3/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw block diagram in5 so3/sout state dvdd dvss mvcc4 pre- driver out1a out1b out2a out2b mvcc12 pre- driver mvcc12 pre- driver mvcc3 si1 dvdd mvcc12 mgnd analog feed-back fclk csb sclk sdata analog feed-back mvcc12 mgnd so1 tsd dvdd por dvdd piout1 dvdd rnf5 vddamp out5a out5b + - dac5 dvdd mgnd piout2 vddamp si2 dvdd so2 si3 dvdd out4a out4b mvcc4 mgnd out3a out3b mvcc3 pre- driver dvddio mgnd logic speed control logic pll dvdd
datasheet datasheet 4/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw description of blocks stepping motor driver (1ch, 2ch driver) built-in stepping motor driver of pwm driving type. 1 stepping motor can be driven. built-in voltage feedback circuit of d-class type. (1) control it corresponds to both the clock in and the autonomous control. ( )clock in control set the registers for t he stepping motor control. the stepping motor is rotated and synchronized with the input clock in the state pin. it is possible to select the mode of stepping motor control from -step, 1-2 phase excitation, 2 phase excitation and the number of edge for electrical angle cycle from 4, 8, 32, 64, 128, 256, 512 or 1024. ( )autonomous control the stepping motor is rotated by setting the registers for the stepping motor control. the state of rotation command (executing: 1, finished: 0) , cache register and motor posit ion are the out put from the serial output (sout pin). also, the signal (mo output) which is synchronized with the motor rotation is the output from state pin. it is possible to select the mode of stepping motor control from -step (1024 portion), 1-2 phase excitation and 2 phase excitation. cache method built-in cache registers. cache registers enable the setting of subs equent process while the motor is in operation. through these registers, operations are done continuously. up down method it is possible to set up, constant and down operation before the motor operates. sin wave control logic pwm control logic sif stm control logic h.b. h.b. host on/off direction torque (speed ? amount) state csb sclk sdata 3 stm sin wave control logic pwm control logic h.b. h.b. host on/off direction speed torque amount state state csb sclk sdata 3 stm position sout sif stm control logic
datasheet datasheet 5/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw description of blocks voltage driver (3ch, 4ch driver) built-in voltage driver of pwm driving type. built-in digital fll speed control logic for 4ch driver. (1) control ( )register control 3ch driver, 4ch driver (at speed control = off) the pwm drive is executed by the pwm duty ratio, the pwm direction and the pwm on/off which are controlled by the register settings. 4ch driver (at speed control = on) the speed control drive is executed by the target speed value, the direction, the coefficient value of pi filter and the turning on/off which are controlled by the register settings. the motor speed is adjusted by comparing the target speed with the motor speed detected at the signal of photo-interrupter. h.b. host target speed pi filter direction on/off csb sclk sdata 3 dcm dcm speed control logic pi pi dr comp pmw control logic sif h.b. host pwm duty direction on/off csb sclk sdata 3 pwm control logic m sif
datasheet datasheet 6/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw description of blocks current driver (5ch driver) built-in constant current driver. the voltage of rnf pin and the extern al resistor (rrnf) determine the am ount of output current. the internal high-precision amplifier (cmos gate input) is used for const ant current control. if any re sistance component exists in the wirings of rnf pin and the external resistor (rrnf), the pr ecision can be reduced. to avoid this, pay utmost attention to the wirings. (1) control ( )register control the constant current drive is executed by the output current value, the current direction and the current on/off which are controlled by the register settings. ( )external pin control the constant current drive is executed by the output current value and the current direction which are controlled by the register settings. constant current driv ing on/off is controlled by in5 pin. host current value direction on/off csb sclk sdata 3 vcm control logic sif current control dac c.c. current value direction csb sclk sdata 3 vcm control logic current control dac c.c. host in5 on/off sif
datasheet datasheet 7/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw absolute maximum ratings (ta=25 ) parameter symbol limit unit remark dvddio dvdd -0.3 to +4.5 v power supply voltage mvcc -0.3 to +7.0 v mvcc12, mvcc3, mvcc4, vddamp input voltage vin -0.3 to supply voltage+0.3 v 500 ma mvcc12, mvcc3, mvcc4, rnf5 +50 ma piout1 input / output current *1 iin +150 ma piout2 storage temperature range tstg -55 to +125 operating temperature range tope -20 to +85 permissible dissipation *2 pd 800 mw *1 must not exceed pd. *2 to use at a temperature higher than ta=25 c, derate 8mw per 1 c (at mounting 50mm x 58mm x 1.75mm glass epoxy board.) recommended operating rating (ta=25 ) parameter symbol limit unit remark i/o power supply voltage dvddio 1.62 to 3.6 v digital power supply voltage dvdd 2.7 to 3.6 v dvdd Qmvcc driver power supply voltage mvcc 2.7 to 5.5 v mvcc12, mvcc3, mvcc4, vddamp clock operating frequency fclk 1 to 28 mhz reference clock
datasheet datasheet 8/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw electrical characteristics (unless otherwise specified, ta = 25 c, dvddio=dvdd=3.0v, mv cc=5.0v, dvss=mgnd=0.0v) limit parameter symbol min typ max unit conditions quiescence (dvddio) issdo - 0 10 a (dvdd) issd - 50 95 a (mvcc) issm - 0 10 a cmd_rs=0 operation (dvddio) idddo - 0.1 1 ma (dvdd) iddd - 4 8 ma cmd_rs=stb=clk_en=1 fclk=24mhz clk_div setting : 0h no load low-level input voltage vil dvss - 0.3dvddio v high-level input voltage vih 0.7dvddio - dvddio v low-level input current iil 0 - 10 a vil=dvss high-level input current iih 0 - 10 a vih=dvddio low-level output voltage vol dvss - 0.2dvddio v iol=1.0ma high-level output voltage voh 0.8dvddio - dvddio v ioh=1.0ma output voltage pivo - 0.15 0.5 v iih=30ma high-level threshold voltage vthh - - 1.9 v dvdd=3.25v low-level threshold voltage vthl 0.9 - - v dvdd=3.25v hysteresis width vhys 0.2 - 0.6 v dvdd=3.25v on-resistance ron - 2.0 2.5 io=100ma (the sum of high and low sides) off-leak current ioz -10 0 +10 a output hiz setting average voltage accuracy between different output pins vdiff -5 - +5 % stm driver(1ch,2ch) vdiff setting : 2bh on-resistance ron - 1.0 1.5 io=100ma (the sum of high and low sides) off-leak current ioz -10 0 +10 a output hiz setting output current io 193 200 207 ma dac setting : 80h rrnf=1
datasheet datasheet 9/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw typical performance curves (unless otherwise specified, ta = 25 c, dvddio=dvdd=3.0v, mvcc= 5.0v, dvss=mgnd=0.0v) 0 20 40 60 80 100 2.02.53.03.54.0 dvdd v static current ua figure 1. dvdd static current voltage dependency 0 2 4 6 8 10 1.0 2.0 3.0 4.0 dvddio v static current ua figure 3. dvddio static current voltage dependency 0 20 40 60 80 100 -50-25 0 25 50 75100 ambient temperature ? static current ua figure 2. dvdd static current temperature dependency 0 2 4 6 8 10 -50 -25 0 25 50 75 100 ambient temperature ? static currentt ua figure 4. dvddio static current temperature dependency
datasheet datasheet 10/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw typical performance curves (unless otherwise specified, ta = 25 c, dvddio=dvdd=3.0v, mvcc= 5.0v, dvss=mgnd=0.0v) 0 2 4 6 8 10 2.0 3.0 4.0 5.0 6.0 mvcc v static current ua figure 5. mvcc static current voltage dependency 0 1 2 3 4 5 2.03.04.05.06.0 mvc c v ron figure 7. output on-resistance mvcc dependency (voltage driver block) 0 2 4 6 8 10 -50 -25 0 25 50 75 100 ambient temperature ? static current ua figure 6. mvcc static current temperature dependency 0 1 2 3 4 5 -50-250 255075100 ambient temperature ? ron figure 8. output on-resistance temperature dependency (voltage driver block) io=100ma io=100ma
datasheet datasheet 11/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw typical performance curves (unless otherwise specified, ta = 25 c, dvddio=dvdd=3.0v, mvcc= 5.0v, dvss=mgnd=0.0v) 0 1 2 3 4 5 2.0 3.0 4.0 5.0 6.0 mvc c v ron figure 9. output on-resistance mvcc dependency (current driver block) 0 1 2 3 4 5 -50-25 0 25 50 75100 ambient temperature ? ron figure 10. output on-resistance temperature dependency (current driver block) 0 1 2 3 4 5 0 32 64 96 128 serial setting code output voltage v figure 11. average voltage accuracy between different output pins (voltage driver block) 0 100 200 300 400 32 64 96 128 160 192 224 256 serial setting code output current ma figure 12. output current (current driver block, r rnf = 1.0 , rl = 5.0 ) io=100ma io=100ma
datasheet datasheet 12/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw typical performance curves (unless otherwise specified, ta = 25 c, dvddio=dvdd=3.0v, mvcc= 5.0v, dvss=mgnd=0.0v) 0.00 0.05 0.10 0.15 0.20 2.0 2.5 3.0 3.5 4.0 dvdd v piout v figure 13. output voltage dvdd dependency (pi driving circuit) 0 100 200 300 400 500 600 700 800 900 1000 0 25 50 75 100 125 150 ambient temperature [ ] power dissipation [mw] figure 14. power dissipation curve 800mw 320mw 85 iih=30ma
datasheet datasheet 13/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw timing chart (unless otherwise specified, ta=25 c, dvddio=dvdd=3.0v parameter symbol specification sclk input cycle tsclk more than 100 nsec sclk l-level input time tsclkl more than 50 nsec sclk h-level input time tsclkh more than 50 nsec sdata setup time tssdata more than 50 nsec sdata hold time thsdata more than 50 nsec csb h-level input time tcsbh more than 380 nsec csb setup time tscsb more than 50 nsec csb hold time thcsb more than 50 nsec fclk input cycle tfclk more than 36 nsec fclk l-level input time tfclkl more than 18 nsec fclk h-level input time tfclkh more than 18 nsec (note1) fclk is asynchronous with sclk. (note2) duty of fclk, sclk are free. csb sclk sdat a tcsbh 0.7dvddio 0.3dvddio tscsb tsclkl tsclk tsclkh 0.7dvddio 0.3dvddio thsdata tssdata 0.7dvddio 0.3dvddio tfclkl tfclk tfclkh fclk 0.7dvddio 0.3dvddio thcsb thcsb tscsb
datasheet datasheet 14/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw serial interface control commands are framed by a 16-bit serial input (msb first) and are sent through csb, sclk, and sdata pins. the 4 higher-order bits specify addresses, while the remaining 12 bits specify data. data of every bit is sent through sdata pin, which is retrieved during the rising edge of sclk. data becomes valid when csb is low and is registered during the rising edge of csb. furthermore, the interface will be synchroniz ed with the falling edges of sc lk to output the sout data of the 12 bits. register map address[3:0] data[11:0] 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 a_mode[1:0] a_sel[2:0] a_different_output_voltage[6:0] 0 0 0 0 a_cycle[5:0] 0 0 0 0 1 0 a_cycle[13:6] 0 1 0 0 0 0 0 0 a_start_pos[3:0] 0 1 1 0 a_bexc 0 0 a_bsl a_aexc 0 0 a_asl 0 0 0 1 1 1 1 0 0 0 a_pos[1:0] 0 a_updw _stop a_ps a_stop 0 0 1 0 a_en a_rt a_pulse[9:0] / a_updw_cycle[9:0] 0 0 1 1 a_act a_busy l l l l l l l l l l 0 1 1 1 a_position[9:6] l l l l l l l l 0 0 0 0 0 a_ansel edge 0 0 0 0 a_ctl 1 0 1 1 0 0 1 0 0 0 so3_sel 0 0 0 0 ext _ctl 1 1 0 0 0 0 chopping[1:0] cachem 0 0 clk_en clk_div[3:0] 0 0 0 0 0 0 0 0 0 0 pi_ctl2 pi_ctl1 0 0 1 0 0 0 0 0 3_state_ctl[1:0] 3_chop[1:0] 0 1 0 0 0 3_pwm_duty[6:0] 1 0 0 0 4_det _sel 0 0 4_spen 4_state_ctl[1:0] 4_chop[1:0] 1 0 0 1 0 4_pwm_duty[6:0] 1 0 1 0 4_tarsp[7:0] 1 0 1 1 0 4_psp[2:0] 0 4_isp[2:0] 1 1 0 1 1 1 1 0 0 0 0 0 4_spc_limit[3:0] 0 0 0 0 5_iout[7:0] 0 1 0 0 0 0 0 0 0 5_state_ctl[2:0] 1 0 1 0 0 0 0 0 0 hys3 hys2 hys1 1 1 1 0 1 1 0 0 0 0 0 stb 0 0 stm_rs cmd_rs addresses other than those above setting prohibited (note1) the notation a is defined as ach: 1ch and 2ch driver. (note2) after reset (power on reset), the initial condition is saved in all registers. (note3) the addresses 4?b0011, and 4?b0111 have data (act, busy, po sition [9:6]), which are internal register values and output from sout pin. (note4) for mode, different output voltage, cycle, en, and rt regi sters, data that are written before the access to the pulse r egister becomes valid and determines the rising edge of csb after the access to the pulse register. (the mode, different output voltage, cycle, en, rt, and pulse regi sters contain cache registers. any registers other than those do not contain cache registers.) csb d13 d14 d9 d8 d10 d11 d5 d4 d6 d7 d1 d0 d2 d3 x d15 x d12 a ddress data sclk sdata d9 d8 d10 d11 d5 d4 d6 d7 d1 d0 d2 d3 x sout hiz hiz
datasheet datasheet 15/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw application example 1ch/2ch -step 3ch pwm stm vcm auto focus iris 5ch c.c. 4ch pwm +fll vcm dcm zoom shutter
datasheet datasheet 16/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw i/o equivalence circuit pin equivalent circuit diagram pin equivalent circuit diagram fclk csb sclk sdata in5 state si1 si2 si3 so1 so2 so3/sout piout1 piout2 out1a out1b out2a out2b out3a out3b out4a out4b out5a out5b p dvddio dvddio dvddio dvddio dvddio p p dvdd dvdd p dvddio dvddio p vddamp p mvcc4 p p mvcc12 p p mvcc3 p p dvdd p rnf5 p
datasheet datasheet 17/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw operational notes 1) absolute maximum ratings if applied voltage, operating temperatur e range, or other absolute maximum ra tings are exceeded, the lsi may be damaged. do not apply voltages or tem peratures that exceed t he absolute maximum ratings. if you expect that any voltage or temperature could be exceedin g the absolute maximum ratings, take physical safety measures such as fuses to prevent any conditions exceeding the absol ute maximum ratings from being applied to the lsi. 2) gnd potential the voltage of the ground pin must be the lowe st voltage of all pins of the ic at all operating conditions. ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 3) thermal design use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (pd) in actual operating conditions. 4) short circuit between pins and malfunctions ensure that when mounting the ic on the pcb the directio n and position are correct. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground. inter-pin shorts could be due to many reasons such as metal particles, water droplets (i n very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 5) operation in st rong magnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 6) power on sequence set dvdd after the setting of dvddio or simultaneously . there is no restriction on the setting of mvcc. to turn on dvdd, be sure to reset at cmd_rs register. 7) thermal shutdown the ic incorporates a built-in thermal shutdown circuit, which is designed to turn off the ic when the internal temperature of the ic reache s a specified value. it is not designed to protect the ic from damage or guarantee its operation. do not continue to operate the ic after this function is activated. do not use the ic in conditions where this function will always be activated. 8) pi drive circuit the output voltage of piout1 should not exceed t he voltage of the power supply voltage dvdd. the output voltage of piout2 should not exceed t he voltage of the power supply voltage vddamp.
datasheet datasheet 18/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw ordering information b u 2 4 0 3 1 g w - e 2 part number package gw : ucsp75m2 packaging and forming specification e2: embossed tape and reel marking diagram ucsp75m2 (top view) u24031 part number marking lot numbe r 1pin mar k
datasheet datasheet 19/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw physical dimension tape and reel information package name ucsp75m2 2 1pin mark p=0.45 4 a 2.500.05 e 5 b 6 b b 0.85max 0.05 a ( 0.15)index post 1 f p=0.45 s 2.500.05 c s 0.06 3 a 0.250.05 0.150.07 d 0.250.05 33- 0.220.05 u24031 lot no. reel direction of f eed 1pin 1234 1234 1234 1234 1234 1234 tape embossed carriertape quantity 3,000pcs/real direction of feed e2 (the direction is 1pin product is at the upper left when you hold reel on the hand and you pull out the tape on the right hand)
datasheet datasheet 20/20 tsz02201-0m2m0bc12010-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.may.2013 rev.003 www.rohm.com tsz22111 ?15 ? 001 bu24031gw revision history date revision changes 24.july.2012 001 new release p.1 correction of writing error. operating temperature range -25 to +85 -20 to +85 p.9 graph scale is changed. figure.3, figure.4 p.10 graph scale is changed. figure.5, figure.6 26.sep.2012 002 p.12 graph scale is changed. figure.13 2.may.2013 003 update some english words, s entences, description, grammar and formatting.
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bu24031gw package ucsp75m2 unit quantity 3000 minimum package quantity 3000 packing type taping constitution materials list inquiry rohs yes bu24031gw - web page distribution inventory

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